The 55nm BCD process platform launched by UMC marks a key milestone in its specialty process layout. It integrates bipolar transistors, CMOS logic and DMOS power devices on a single chip, delivering high-efficiency power management solutions for multiple fields.
The platform comprises three differentiated process types. The non-epitaxial process achieves cost-effectiveness through a unique architecture, suitable for mobile and consumer devices. The epitaxial process complies with the automotive AEC-Q100 Grade 0 standard, supports 150V high voltage, and ensures the reliability of automotive electronics in extreme environments. The SOI process meets the automotive Grade 1 standard, featuring outstanding noise immunity and low leakage performance, ideal for high-end automotive and industrial scenarios. It also integrates ultra-thick metal layers, embedded flash memory and RRAM memristors to optimize current transmission, storage efficiency and state retention capabilities respectively.
In terms of applications, it precisely covers three major sectors. In automotive electronics, it facilitates the integration of components such as on-board chargers, enhancing the energy efficiency and driving range of new energy vehicles. In industrial scenarios, it resolves the conflict between high-voltage drive and precision control, improving the stability of servo drives. In consumer electronics, it meets the demands for miniaturization and low heat generation in fast charging solutions above 65W.
As an extension of the industry's most comprehensive BCD technology portfolio, its process nodes span from 0.35μm to 55nm. Coupled with abundant IP resources and design support, it can accelerate customers' product development cycles. Amid intensifying competition in mature processes, this platform further strengthens UMC's competitiveness in the smart power and mixed-signal markets, providing core support for technological upgrades across multiple industries.
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